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Advanced Wirebond Interconnection Technology (Cód: 6326439)

Shankara K. Prasad


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From the reviews:'This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.
Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included.The book is very good with 'visual' explanations for quick grasping of the issues. In addition,
the fundamental metallurgical or mechanical root causes behind material and process choices are presented.The book has a clear prose style and a very readable font and page layout. The figures, although
effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness.This book has excellent overall tutorial and enough description of wire and bonding equipment
so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the 'window' of adjustments. The book ends with
discussions on establishing quality metrics and reliability assurance tests.Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but
good reference section is at the end.If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book.' ( CMPT
Newsletter, June 2005)


Produto sob encomenda Sim
Cód. Barras 9781402077623
Altura 23.40 cm
I.S.B.N. 9781402077623
Profundidade 3.81 cm
Referência 9781402077623
Ano da edição 2004
Idioma Inglês
Número de Páginas 704
Peso 0.91 Kg
Largura 15.60 cm
AutorShankara K. Prasad


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